6 September 2021

Engis launches high-precision vertical grinding machines

Engis Corp of Wheeling, IL, USA, which provides superabrasive lapping, grinding, honing and polishing products, has launched the EVG Series of high-precision vertical grinding machines for the production of ultra-smooth surfaces. The machines have been designed to grind advanced materials to a high degree of precision in flatness and surface quality, greatly reducing or even eliminating the need for subsequent lapping, moving directly from grinding to final polish.

Applications include grinding or back-thinning of semiconductor wafers – e.g. silicon carbide (SiC), gallium arsenide (GaAs), sapphire, silicon, gallium nitride (GaN), aluminium nitride (AIN) and indium phosphide (InP) – of semiconductor processing equipment components (e.g. ceramic chucks, glass ceramic) and of substrates for semiconductor advanced packaging, including MEMS (ceramic, polyimide).

Engis’ new EVG machine.

Picture: Engis’ new EVG machine.

The new machines are available in three different models (EVG-200, EVG-250 and EVG-300), all of which incorporate a programmable logic controller, 400rpm (maximum) work-table speed and 2000rpm (maximum) wheel speed. Sizes vary from 800 x 800 x 1900 for the EVG-200 up to 1050 x 1050 x 2020 for the EVG-300. All ha ve been designed with ergonomics in mind, with easy access to the work area and with a variety of chuck options.

Advanced machine control options are available, providing automated grinding wheel dressing, automated positioning of the grinding wheel relative to the workpiece, and workpiece thickness measurement.  For maximum control, an upgrade to in-process thickness measurement with feedback to the grinding cycle in real time is also available.

The most advanced model offers automated thickness options: multi-point contact probing for multiple wafer grinding or a choice of contact or non-contact continuous in-process measurement for single-wafer machining.

EVG Series machines are equipped with Engis grinding wheels based on the Mixed Abrasive Diamond (MAD) wheel technology, which tailors the wheel to the material being processed.

Engis says that its specialist application engineers can provide specific process recommendations for particular materials and applications.

Tags: CMP SiC

Visit: www.engis.com