11 January 2021
Rohinni LLC of Coeur d’Alene, ID, USA (which has developed a proprietary method for transferring mini- and micro-LEDs to substrates) has achieved what it claims is the fastest proven mini-LED placement speed of 100Hz with its new bondhead. The new technology effectively doubles placement speed and halves the cost of placing mini-LEDs compared with the firm’s first generation of placement technology.
“In 2021, we will start to see mainstream adoption of premium products using mini-LEDs in TV, video wall and consumer electronics applications like tablets and notebooks,” says CEO Matt Gerber. “Our new bondhead technology is driving this market by enabling true high-volume manufacturing at a lower cost,” he adds. “This translates into less expensive devices for consumers, which will drive adoption and spur manufacturers to start implementing new designs for the coming wave of mini-LED-based products.”
Rohinni says that its placement technology enables its joint ventures in design and manufacturing of mini-LED-based logos and keyboard backlighting (Luumii), displays (BOE Pixey) and mobility (Magna Rohinni Automotive) to provide faster speeds, resulting in lower manufacturing costs.
Rohinni says that OEMs in markets ranging from consumer to automotive to outdoor signage can incorporate its technology, yielding products that are brighter, thinner, lighter, lower power and more dynamic than those currently on the market.