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AXT’s Tongmei receives China export permits to resume shipping InP substrates to certain customers

by Semiconductor News | Aug 20, 2025 | Semiconductor News

News: Suppliers 20 August 2025 AXT’s Tongmei receives China export permits to resume shipping InP substrates to certain customers AXT Inc of Fremont, CA, USA – which makes gallium arsenide (GaAs), indium phosphide (InP) and germanium (Ge) substrates and raw materials...

QPT launches first AI-ready motor drive for collaborative robots

by Semiconductor News | Aug 18, 2025 | Semiconductor News

News: Microelectronics 18 August 2025 QPT launches first AI-ready motor drive for collaborative robots Independent power electronics company Quantum Power Transformation (QPT) Ltd of Cambridge, UK — which was founded in 2019 and develops gallium nitride (GaN)-based...

OKI develops Tiling crystal film bonding

by Semiconductor News | Aug 18, 2025 | Semiconductor News

News: Optoelectronics 18 August 2025 OKI develops Tiling crystal film bonding Tokyo-based Oki Electric Industry Co Ltd has developed Tiling crystal film bonding (CFB) technology using its proprietary CFB technology. The technology enables the heterogeneous integration...

k-Space’s RHEEDSim software available for labs and classrooms

by Semiconductor News | Aug 13, 2025 | Semiconductor News

News: Suppliers 13 August 2025 k-Space’s RHEEDSim software available for labs and classrooms k-Space Associates Inc of Dexter, MI, USA — which produces thin-film metrology instrumentation and software — says that its new kSA RHEEDSim reflection high-energy electron...

AOI chooses ClassOne’s Solstice S8 system for gold plating and metal lift-off on InP

by Semiconductor News | Aug 13, 2025 | Semiconductor News

News: Suppliers 13 August 2025 AOI chooses ClassOne’s Solstice S8 system for gold plating and metal lift-off on InP ClassOne Technology of Kalispell, MT, USA (which manufactures electroplating and wet-chemical process systems for ≤200mm wafers) is providing its...
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