by Semiconductor News | Dec 5, 2024 | Semiconductor News
News: Microelectronics 5 December 2024 US DoE awards eight winners for Phase 1 of Silicon Carbide (SiC) Packaging Prize The US Department of Energy’s (DoE) Office of Electricity (OE) has announced the eight winners of the Silicon Carbide (SiC) Packaging Prize Phase 1...
by Semiconductor News | Dec 4, 2024 | Semiconductor News
News: Microelectronics 4 December 2024 AKM ships its smallest and thinnest InAs Hall element, with volume shrunk by 85% Japan-based Asahi Kasei Microdevices (AKM, a member of the Asahi Kasei Group’s Material sector) has begun mass production and shipment of its...
by Semiconductor News | Dec 3, 2024 | Semiconductor News
News: Microelectronics 3 December 2024 ST supplying silicon carbide power modules to Renault for Ampere’s EVs As the next step in their strategic co-operation, STMicroelectronics of Geneva, Switzerland has reached a multi-year agreement from 2026 to supply its silicon...
by Semiconductor News | Dec 2, 2024 | Semiconductor News
News: Microelectronics 2 December 2024 QPT files patent for die attach process that boosts waste heat removal by up to 15x As the power handled by transistors increases to meet the needs of new applications, power electronics packaging will increasingly struggle to...
by Semiconductor News | Nov 29, 2024 | Semiconductor News
News: LEDs 29 November 2024 At a formal ceremony in Berlin, Germany’s President Frank-Walter Steinmeier presented the Deutscher Zukunftspreis 2024 (the German Future Award, the Federal President’s Award for Innovation in Science and Technology) to a team led by Dr...
