by Semiconductor News | Nov 22, 2024 | Semiconductor News
News: Optoelectronics 22 November 2024 Aeluma wins NASA contract to advance quantum dot photonic integrated circuits for aerospace and AI Aeluma Inc of Goleta, CA, USA – which uses compound semiconductor materials on large-diameter substrates to develop technologies...
by Semiconductor News | Nov 21, 2024 | Semiconductor News
News: Microelectronics 21 November 2024 GlobalFoundries’ $1.5bn US CHIPS Act funding confirmed by Department of Commerce Following the completion of due diligence, the US Department of Commerce has confirmed the award (proposed in February) of up to $1.5bn in direct...
by Semiconductor News | Nov 21, 2024 | Semiconductor News
News: Suppliers 21 November 2024 US Geological Survey reckons China ban on gallium and germanium exports could cost $3.4bn in US GDP US Geological Survey (USGS) researchers have developed a new model to assess how disruptions of critical mineral supplies may affect...
by Semiconductor News | Nov 21, 2024 | Semiconductor News
News: Suppliers 21 November 2024 US DOE announces $10m funding for Critical Materials Innovation Hub The US Department of Energy’s (DOE’s) Critical Materials Innovation Hub (CMI Hub) has announced up to $10m in federal funding to accelerate the early-stage technology...
by Semiconductor News | Nov 20, 2024 | Semiconductor News
News: Suppliers 20 November 2024 ASMPT’s AMICRA NANO die and flip-chip bonder targets co-packaged optics ASMPT Ltd says that its new high-precision AMICRA NANO die and flip-chip bonder has been specially developed for the production of co-packaged optics where optical...
